MAGNETRON SPUTTERING SYSTEM

• Sputtering is one of the physical deposition methods using the principle that ionized cation gas (Ar+) strongly collides with the target in the plasma state and the target material is deposited on the substrate by momentum transfer.
• Magnetron sputtering equipment is research and development equipment suitable for research and production of metal, semiconductor, and insulator thin films. there is.
• The sputtering equipment made by Dong-A is completely separated from the cooling water and magnet, so there is no effect such as replacement of oxidation of magnets due to periodic contact with water and reduction of deposition rate due to weakening of magnetic fields.

FAST SPUTTER SYSTEM

• It takes about 10 minutes to evacuate up to a degree of vacuum of 10 E10-6, so many experiments can be done in a day.
• A multi-layer film can be formed automatically up to the basic 10 layers, and more is possible according to the order specification.
• Basic 10 kinds of various process variables are stored in the internal memory.
• 2″ Magnetron Sputter Guns are installed as standard.