PECVD is one of the chemical vapor deposition methods that mix and inject various reactive gases after evacuation and then activate the reactive gases using plasma to cause a desired chemical reaction on the substrate and form a thin film thereon. It is a general-purpose equipment used in the semiconductor manufacturing process.
CVD types include Thermal CVD, Plasma Enhanced CVD, Microwave CVD, Laser CVD, and MOCVD (Metal Organic CVD).